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TYN1225RG Folha de dados(PDF) 3 Page - STMicroelectronics |
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TYN1225RG Folha de dados(HTML) 3 Page - STMicroelectronics |
3 / 10 page TN2540, TXN625, TYN625, TYN825, TYN1225 Characteristics Doc ID 7478 Rev 8 3/10 Table 4. Thermal resistances Symbol Parameter Value Unit Rth(j-c) Junction to case (DC) D2PAK, TO-220AB 1.0 °C/W TO-220AB ins 2.0 Rth(j-a) Junction to ambient (DC) S(1) = 1 cm2 1. S = Copper surface under tab. D2PAK 45 °C/W TO-220AB, TO-220AB ins 60 Figure 1. Maximum average power dissipation versus average on-state current Figure 2. Average and DC on-state current versus case temperature P(W) 0 2 4 6 8 10 12 14 16 18 20 22 02 46 8 10 12 14 16 I (A) T(AV) 360° α I (A) T(AV) 0 2 4 6 8 10 12 14 16 18 20 22 24 26 28 0 25 50 75 100 125 D2PAK TO-220AB TO-220ABins α = 180° DC T (°C) case Figure 3. Average and DC on-state current versus ambient temperature Figure 4. Relative variation of thermal impedance versus pulse duration (D2PAK, and TO-220AB) I (A) T(AV) 0,0 0,5 1,0 1,5 2,0 2,5 3,0 3,5 0 25 50 75 100 125 D2PAK TO-220AB TO-220ABins DC α = 180° T (°C) amb 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 0.01 0.10 1.00 K=[Z /R th th] t (s) p Zth(j-c) Zth(j-a) |
Nº de peça semelhante - TYN1225RG |
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Descrição semelhante - TYN1225RG |
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