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CD4041UBPWE4 Folha de dados(PDF) 4 Page - Texas Instruments |
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CD4041UBPWE4 Folha de dados(HTML) 4 Page - Texas Instruments |
4 / 14 page PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) CD4041UBE ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD4041UBEE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD4041UBF ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type CD4041UBF3A ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type CD4041UBM ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBM96 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBM96E4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBM96G4 ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBME4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBMG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBMT ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBMTE4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBMTG4 ACTIVE SOIC D 14 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBPW ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBPWE4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBPWG4 ACTIVE TSSOP PW 14 90 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBPWR ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBPWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD4041UBPWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 Addendum-Page 1 |
Nº de peça semelhante - CD4041UBPWE4 |
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Descrição semelhante - CD4041UBPWE4 |
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