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CD4517BMS Folha de dados(PDF) 9 Page - Intersil Corporation |
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CD4517BMS Folha de dados(HTML) 9 Page - Intersil Corporation |
9 / 9 page 1205 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. Taiwan Limited 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029 CD4517BMS Chip Dimensions and Pad Layouts Dimensions in parentheses are in milimeters and are derived from the basic inch dimensions as indicated. Grid graduations are in mils (10-3 inch.) METALLIZATION: Thickness: 11k Å − 14kÅ, AL. PASSIVATION: 10.4kÅ - 15.6k Å, Silane BOND PADS: 0.004 inches X 0.004 inches MIN DIE THICKNESS: 0.0198 inches - 0.0218 inches 106 90 80 70 60 50 40 30 20 10 0 0 102030 4050 60 70 8090 100 103-111 (2.617-2.819) 140-148 (3.556-3.759) 4-10 (0.102-0.254) 100 110 120 130 140 143 |
Nº de peça semelhante - CD4517BMS |
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Descrição semelhante - CD4517BMS |
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