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BDxxFA1FP3

Datasheet

TSZ02201-0GAG0A600600-1-2

© 2015 ROHM Co., Ltd. All rights reserved.

www.rohm.com

TSZ22111･15･001

08.Jun.2015 Rev.003

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Operational Notes

(1) Absolute Maximum Value Rate

Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all

destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit

protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the absolute maximum

ratings.

(2) Reverse connection of power supply

Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when

connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply

terminals.

(3) Power supply line

Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply lines

of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the

analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature

and aging on the capacitance value when using electrolytic capacitors.

(4) Ground voltage

The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that no

pins are at a voltage below the ground pin at any time, even during transient condition.

(5) Thermal consideration

Use a thermal design that allows for a sufficient margin by taking into account the permissible power dissipation (Pd) in

actual operating conditions.

(6) Short between pins and mounting errors

Be careful when mounting the IC on printed circuit boards. The IC may be damaged if it is mounted in a wrong

orientation or if pins are shorted together. Short circuit may be caused be conductive particles caught between the pins.

(7) Operation under strong electromagnetic field

Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.

(8) ASO

Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe

Operation (ASO).

(9) Thermal shutdown circuit

The IC incorporates a built-in thermal shutdown circuit, which is designed to turn off the IC when the internal temperature

of the IC reaches a specified value. It is not designed to protect the IC from damage or guarantee its operation. Do not

continue to operate the IC after this function is activated. Do not use the IC in conditions where this function will always

be activated.

(10) Testing on application boards

When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject

the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should

always be turned off completely before connecting or removing it from the test setup during the inspection process. To

prevent damage from electro static discharge, ground the IC during assembly and use similar precautions during

transport and storage.

TSD ON Temperature [°C] (typ.)

Hysteresis Temperature [°C] (typ.)

BDxxFA1FP3

175

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