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BCP56 Folha de dados(PDF) 11 Page - NXP Semiconductors |
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BCP56 Folha de dados(HTML) 11 Page - NXP Semiconductors |
11 / 22 page BCP56_BCX56_BC56PA All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 9 — 25 October 2011 11 of 22 NXP Semiconductors BCP56; BCX56; BC56PA 80 V, 1 A NPN medium power transistors FR4 PCB, single-sided copper, mounting pad for collector 6 cm2 Fig 12. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values FR4 PCB, 4-layer copper, standard footprint Fig 13. Transient thermal impedance from junction to ambient as a function of pulse duration for SOT1061; typical values 006aac685 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10–2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 0.25 006aac686 10 1 102 103 Zth(j-a) (K/W) 10–1 10–5 10 10–2 10–4 102 10–1 tp (s) 10–3 103 1 0 duty cycle = 1 0.01 0.05 0.1 0.2 0.33 0.5 0.75 0.02 0.25 |
Nº de peça semelhante - BCP56_15 |
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Descrição semelhante - BCP56_15 |
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