CYStech Electronics Corp.

Spec. No. : C972DFJ6

Issued Date : 2015.04.01

Revised Date : 2015.09.03

Page No. : 9/9

MTB010N02DFJ6

CYStek Product Specification

DFNWB2×2-6L-J Dimension

DIM

Millimeters

Inches

DIM

Millimeters

Inches

Min.

Max.

Min.

Max.

Min.

Max.

Min.

Max.

A

0.700

0.800

0.028

0.031

D2

0.200

0.400

0.008

0.016

A1

0.000

0.050

0.000

0.002

E2

0.460

0.660

0.018

0.026

A3

0.203 REF

0.008 REF

k

0.200

-

0.008

-

D

1.924

2.076

0.076

0.082

b

0.250

0.350

0.010

0.014

E

1.924

2.076

0.076

0.082

e

0.650 TYP

0.026 TYP

D1

0.800

1.000

0.031

0.039

L

0.174

0.326

0.007

0.013

E1

0.850

1.050

0.033

0.041

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

 Lead: Pure tin plated.

 Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0.

Important Notice:

 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

 CYStek reserves the right to make changes to its products without notice.

 CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

 CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.

Marking:

Style: Pin 1.Drain

2.Drain 3.Gate

4.Source

5.Drain 6.Drain

6-Lead DFNWB2×2-6L-J Plastic

Surface Mounted Package

CYStek Package Code: DFJ6

BT02

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Device

Code

Date

Code