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TS5A1066 Folha de dados(PDF) 2 Page - Texas Instruments |
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TS5A1066 Folha de dados(HTML) 2 Page - Texas Instruments |
2 / 30 page TS5A1066 SCDS185C – JANUARY 2005 – REVISED SEPTEMBER 2012 www.ti.com Table 2. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP (Pb- Tape and reel TS5A1066YZPR JD_ free) –40°C to 85°C SOT (SOT-23) – DBV Tape and reel TS5A1066DBVR JAD_ SOT (SC-70) – DCK Tape and reel TS5A1066DCKR JD_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). FUNCTION TABLE NO TO COM, IN COM TO NO L OFF H ON Absolute Minimum and Maximum Rating (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT V+ Supply voltage range(3) –0.5 6.5 V VNO Analog voltage range(3) (4) (5) –0.5 V+ + 0.5 V VCOM IK Analog port diode current VNO, VCOM < 0 or VNO, VCOM > V+ –50 50 mA INO On-state switch current VNO, VCOM = 0 to V+ –50 50 mA ICOM VI Digital input voltage range(3) (4) –0.5 6.5 V IIK Digital input clamp current VI < 0 –50 mA I+ Continuous current through each V+ or GND –100 100 mA IGND DBV package 206 θJA Package thermal impedance(6) DCK package 252 °C/W YZP package 132 Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum. (3) All voltages are with respect to ground, unless otherwise specified. (4) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. (5) This value is limited to 5.5 V maximum. (6) The package thermal impedance is calculated in accordance with JESD 51-7. 2 Submit Documentation Feedback Copyright © 2005–2012, Texas Instruments Incorporated Product Folder Links: TS5A1066 |
Nº de peça semelhante - TS5A1066_15 |
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Descrição semelhante - TS5A1066_15 |
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