NC

GND

NO

IN

COM

GND

2

8

3

4

6

7

1

5

A1

A2

B2

C2

D2

B1

C1

D1

TS5A6542

www.ti.com

SCDS211C – AUGUST 2006 – REVISED DECEMBER 2009

0.75-

Ω SPDT ANALOG SWITCH WITH INPUT LOGIC TRANSLATION

Check for Samples: TS5A6542

1

FEATURES

•

Specified Break-Before-Make Switching

•

COM Port to GND

•

Low ON-State Resistance (0.75

Ω Max)

–

8000-V Human-Body Model

(A114-B, Class II)

•

–

±15-kV Contact Discharge (IEC 61000-4-2)

•

Low Charge Injection

•

Excellent ON-State Resistance Matching

APPLICATIONS

•

Low Total Harmonic Distortion (THD)

•

Cell Phones

•

•

PDAs

•

•

Portable Instrumentation

•

Latch-Up Performance Exceeds 100 mA Per

YZP PACKAGE

JESD 78, Class II

(BOTTOM VIEW)

•

ESD Performance Tested Per JESD 22

–

4000-V Human-Body Model

(A114-B, Class II)

–

1000-V Charged-Device Model (C101)

–

400-V Machine Model (A115-A)

DESCRIPTION/ORDERING INFORMATION

The TS5A6542 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 2.25 V to

5.5 V. The device offers a low ON-state resistance with an excellent channel-to-channel ON-state resistance

matching, and the break-before-make feature to prevent signal distorion during the transferring of a signal from

one path to another. The device has excellent total harmonic distortion (THD) performance and consumes very

low power. These features make this device suitable for portable audio applications.

powers the control circuitry, which allows the TS5A6542 to be controlled by 1.8-V signals.

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

–40°C to 85°C

0.23-mm Large Bump – YZP

Tape and reel

TS5A6542YZPR

_ _ _ JH7

(Pb-free)

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2006–2009, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.