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TPA3004D2 Folha de dados(PDF) 5 Page - Texas Instruments |
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TPA3004D2 Folha de dados(HTML) 5 Page - Texas Instruments |
5 / 47 page TPA3004D2 www.ti.com SLOS407E – FEBRUARY 2003 – REVISED JANUARY 2011 Pin Functions (continued) Pin I/O DESCRIPTION NO. NAME VOLUME 11 I DC voltage that sets the gain of the Class-D and VAROUT outputs. VREF 8 I Analog reference for gain control section. V2P5 4 O 2.5-V Reference for analog cells, as well as reference for unused audio input when using single-ended inputs. — Thermal — Connect to AGND and PGND—should be center point for both grounds. Pad ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) UNIT Supply voltage range: AVCC, PVCC -0.3 V to 20 V Load impedance, RL ≥ 3.6 Ω MODE, VREF, VARDIFF, VARMAX, VOLUME, FADE 0 V to 5.5 V Input voltage range, VI SD -0.3 V to VCC + 0.3 V RINN, RINP, LINN, LINP -0.3 V to 7 V AVDD 120 mA Supply current AVDDREF 10 mA Output current VAROUTL, VAROUTR 20 mA Continuous total power dissipation See the Thermal Information Table Operating free-air temperature range, TA -40°C to 85°C Operating junction temperature range, TJ (2) -40°C to 150°C Storage temperature range, Tstg -65°C to 150°C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The (TPA3004D2) incorporates an exposed PowerPAD on the underside of the chip. This acts as a heatsink and must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in exceeding the maximum junction temperature that could permanently damage the device. See TI Technical Brief SLMA002 for more information about utilizing the PowerPAD thermally enhanced package. THERMAL INFORMATION TPS3004D2 THERMAL METRIC(1)(2) UNITS PHP (48) PIN qJA Junction-to-ambient thermal resistance 26.6 qJCtop Junction-to-case (top) thermal resistance 12.6 qJB Junction-to-board thermal resistance 7.9 °C/W yJT Junction-to-top characterization parameter 0.1 yJB Junction-to-board characterization parameter 4.2 qJCbot Junction-to-case (bottom) thermal resistance 0.2 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) For thermal estimates of this device based on PCB copper area, see the TI PCB Thermal Calculator. Copyright © 2003–2011, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): TPA3004D2 |
Nº de peça semelhante - TPA3004D2_15 |
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Descrição semelhante - TPA3004D2_15 |
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