with thermal grease such as contamination

of electronic assemblies and reflow solder

soldering and cleaning without worry. When

clamped between two surfaces, the

elastomer conforms to surface textures

thereby creating an air-free interface

between heat-generating components

and heat sinks.

to withstand processing stresses without

losing physical integrity. It also provides

ease of handling during application.

Note: To build a part number, visit our

website at www.bergquistcompany.com.

TYPICAL APPLICATIONS INCLUDE

• Between a transistor and a heat sink

• Between two large surfaces such as an L-bracket and the chassis of an assembly

• Between a heat sink and a chassis

• Under electrically isolated power modules or devices such as resistors,

transformers and solid state relays

CONFIGURATIONS AVAILABLE

• Sheet form, die-cut parts and roll form

• With or without pressure sensitive adhesive

PDS_QPad_3_December 2008

FEATURES AND BENEFITS

(@50 psi)

• Eliminates processing constraints

typically associated with grease

• Conforms to surface textures

• Easy handling

• May be installed prior to soldering and

cleaning without worry

PRODUCT DESCRIPTION

Glass-Reinforced Grease

Replacement Thermal Interface

December 2008

PROPERTY

IMPERIAL VALUE

METRIC VALUE

TEST METHOD

Color

Black

Black

Visual

Reinforcement Carrier

Fiberglass

Fiberglass

—

Thickness (inch) / (mm)

0.005

0.127

ASTM D374

Hardness (Shore A)

86

86

ASTM D2240

Continuous Use Temp (°F) / (°C)

-76 to 356

-60 to 180

—

ELECTRICAL

Dielectric Breakdown Voltage (Vac)

Non-Insulating

Non-Insulating

ASTM D149

Dielectric Constant (1000 Hz)

NA

NA

ASTM D150

Volume Resistivity (Ohm-meter)

ASTM D257

Flame Rating

V-O

V-O

U.L.94

THERMAL

Thermal Conductivity (W/m-K)

2.0

2.0

ASTM D5470

THERMAL PERFORMANCE vs PRESSURE

Pressure (psi)

10

25

50

100

200

TO-220 Thermal Performance (°C/W)

2.26

1.99

1.76

1.53

1.30

0.65

0.48

0.35

0.24

0.16

1) The ASTM D5470 test fixture was used. The recorded value includes interfacial thermal resistance. These values are provided for

reference only. Actual application performance is directly related to the surface roughness, flatness and pressure applied.

TYPICAL PROPERTIES OF Q-PAD 3