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MC33064LP Folha de dados(PDF) 2 Page - Microsemi Corporation

Nome de Peças MC33064LP
Descrição Electrónicos  UNDERVOLTAGE SENSING CIRCUIT
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Fabricante Electrônico  MICROSEMI [Microsemi Corporation]
Página de início  http://www.microsemi.com
Logo MICROSEMI - Microsemi Corporation

MC33064LP Folha de dados(HTML) 2 Page - Microsemi Corporation

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TRANSIENT IMMUNE UNDERVOLTAGE SENSING CIRCUIT
MC33064/MC34064
PRODUCT DA T ABOOK 1996/1997
Copyright © 1999
Rev. 1.3
6/99
2
P RODUCTION
D AT A
S HEET
ABSOLUTE MAXIMUM RATINGS
(Note 1)
Input Supply Voltage (V
IN) ............................................................................... -1V to 10V
RESET Output Voltage (V
OUT) ..................................................................................... 10V
Output Sink Current (I
OL) ............................................................ Internally Limited (mA)
Clamp Diode Forward Current (I
F), Pin 1 to pin 2 ............................................... 100mA
Operating Junction Temperature
Plastic (DM, LP - Packages) .................................................................................. 150°C
Storage Temperature Range ...................................................................... -65°C to 150°C
Lead Temperature (Soldering, 10 seconds) ............................................................. 300°C
PACKAGE PIN OUTS
DM PACKAGE
(Top View)
Note 1. Values beyond which damage may occur. All voltages are specified with respect to
ground, and all currents are positive into the specified terminal.
DM PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
165°C/W
LP PACKAGE:
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
θθθθθ
JA
156°C/W
Junction Temperature Calculation:
T
J = TA + (PD x θJA).
The
θ
JA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no ambient airflow
THERMAL DATA
BLOCK DIAGRAM
LP PACKAGE
(Top View)
3. GROUND
2. V
IN
1. RESET
RESET
V
IN
N.C.
GROUND
N.C.
N.C.
N.C.
N.C.
18
27
36
45
1.2 V
REF
V
IN
RESET
GROUND


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