STK673-010-E

No.5708-2/15

Specifications

Maximum Ratings at Tc = 25

°C

Parameter

Symbol

Conditions

Ratings

Unit

Maximum supply voltage 1

VCC1 max

VCC2 = 0V

36

V

Maximum supply voltage 2

VCC2 max

No signal

-0.3 to +7.0

V

Input voltage

VIN max

Logic input pins

-0.3 to +7.0

V

Phase output current

IO max

VCC2 = 5 V, CLOCK ≥ 100Hz

4.0

A

Operating substrate temperature

Tc max

105

°C

Junction temperature

Tj max

150

°C

Storage temperature

Tstg

-40 to +125

°C

Allowable Operating Ranges at Ta = 25

°C

Parameter

Symbol

Conditions

Ratings

Unit

Operating supply voltage 1

VCC1

With signal

16 to 30

V

Operating supply voltage 2

VCC2

With signal

5.0V

± 5%

V

Input voltage

VIH

0 to VCC2

V

Phase output current 1

IO1

Without heat sink

1.7

A

Phase output current 2

IO2

Tc = 105°C

2.4

A

Clock frequency

fCL

Pin 11 input frequency

0 to 50

kHz

Electrical Characteristics at Tc = 25

°C, VCC1 = 24V, VCC2 = 5V

Rating

Parameters

Symbol

Conditions

min

typ

max

unit

VCC2 supply current

ICCO

Enable=Low

6.1

12

mA

Effective output current

Ioave

Each phase R/L=2

Ω /6mH

2W2-3-phase excitation Vref = 0.61V

0.62

0.69

0.76

Arms

FET diode forward voltage

Vdf

If= 1A (RL=23Ω)

1.0

1.6

V

Output saturation voltage

Vsat

RL = 23Ω

0.45

0.56

V

Output leakage current

IOL

RL = 23Ω

0.1

mA

Input high voltage

VIH

9 terminals, Pins 11 to 18, 22

4.0

V

Input low voltage

VIL

9 terminals, Pins 11 to 18, 22

1.0

V

Input current

IIL

Pins 11 to 18 pin = GND level

pull-up resistance 20k

Ω (typ)

115

250

550

μA

Vref input voltage

VrH

Pin 10

VCC2/2

V

Vref input current

Ir

Pin 10, pin 10 = 2.5V

Internal resistance 40k

Ω (typ)

440

625

810

μA

MOI output high voltage

VOH

Pin 20, pin 20 to 19 = 820

Ω

2.5

V

MOI output low voltage

VOL

Pin 20, pin 21 to 20 = 1.6k

Ω

0.4

V

PWM frequency

fc

63

kHz

Note: Constant voltage supply is used.

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating

Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.