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STK984-190-E Folha de dados(PDF) 1 Page - ON Semiconductor

Nome de Peças STK984-190-E
Descrição Electrónicos  Mini Buck Converter for RF Power Amplifiers
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Fabricante Electrônico  ONSEMI [ON Semiconductor]
Página de início  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

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Publication Order Number :
STK984-190-E/D
www.onsemi.com
©
Semiconductor Components Industries, LLC, 2015
October 2015 - Rev. P0
ORDERING INFORMATION
See detailed ordering and shipping information on page 9 of this data sheet.
STK984-190-E
Overview
The STK984-190-E is a Power Module designed to be used in brush-less
DC motor.
Function
 It is possible to make seven MOSFETs 1 small packages by heat
dissipation substrate and transfer mold technology.
Specifications
Absolute Maximum Ratings at Tc = 25C
Parameter
Symbol
Conditions
Ratings
Unit
Drain−to−Source Voltage
VDSS
40
V
Control Input Voltage
VIN max
Gate COM to +B, Gate 1H to 1,
Gate 2H to 2, Gate 3H to 3,
Gate 1L, Gate 2L, Gate 3L to GND
+/
20
V
Continuous Drain Current
ID max
DC
30
A
Pulsed Drain Current
ID pulse
Pulse ( tp = 10 μs)
85
A
Power Dissipation
Pd max
Each channel
Tc=25℃
36
W
Junction Temperature
Tj max
Semiconductor Device
175
C
Operating Temperature
Tc
Substrate Temperature
40 to 150
C
Storage Temperature
Tstg
-
40 to 150
C
Recommended Operating Conditions at 40C ≤ Tc ≤ 125C
Parameter
Symbol
Conditions
Ratings
Unit
min
typ
max
Supply Voltage
V+B max
+B to GND
8
13.5
18
V
Control Input Voltage
VIN
Gate COM to +B, Gate 1H to 1,
Gate 2H to 2, Gate 3H to 3,
Gate 1L, Gate 2L, Gate 3L to GND
10
18
V
Drain Current
ID
Tc=125℃, Gate HU to LW=10V
-
-
25
A
Operating Substrate Temperature
Tc
Thick Film IC Substrate Temperature
40
-
125
C
Thermal Resistance
Parameter
Symbol
Conditions
Ratings
Unit
min.
typ.
max.
Chip-Case Resistance
Θj-c
Junction-to-backside of the substrate
MOSFET/ch
-
-
4.1
C /W
Advance Information
Power Module
for 3-phase Brushless DC Motor
for Automotive
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating
Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended
Operating Ranges limits may affect device reliability.


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