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TPA2011D1YFFT Folha de dados(PDF) 4 Page - Texas Instruments |
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TPA2011D1YFFT Folha de dados(HTML) 4 Page - Texas Instruments |
4 / 30 page A1 IN+ A2 GND A3 V O- B1 B2 PV DD B3 PGND V DD C1 IN- C2 EN C3 V O+ 1.214 mm TPA2011D1 SLOS626B – DECEMBER 2009 – REVISED NOVEMBER 2015 www.ti.com 6 Pin Configuration and Functions YFF Package 9-Pin DSBGA Top View Pin Functions PIN I/O DESCRIPTION NAME NO. EN C2 I Shutdown terminal. When terminal is low the device is put into Shutdown mode. Analog ground terminal. Must be connected to same potential as PGND using a direct connection GND A2 I to a single point ground. IN– C1 I Negative differential audio input IN+ A1 I Positive differential audio input High-current Analog ground terminal. Must be connected to same potential as GND using a direct PGND B3 I connection to a single point ground. High-current Power supply terminal. Must be connected to same power supply as VDD using a PVDD B2 I direct connection. Voltage must be within values listed in Recommended Operating Conditions table. Power supply terminal. Must be connected to same power supply as PVDD using a direct VDD B1 I connection. Voltage must be within values listed in Recommended Operating Conditions table. VO- A3 O Negative BTL audio output VO+ C3 O Positive BTL audio output 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range, TA = 25°C (unless otherwise noted) (1) MIN MAX UNIT In active mode –0.3 6 V Supply VDD, PVDD voltage In shutdown mode –0.3 6 V VI Input EN, IN+, IN– V –0.3 VDD + 0.3 voltage RL Minimum load resistance 3.2 Ω Output continuous total power dissipation See Dissipation Ratings TA Operating free-air temperature –40 85 °C TJ Operating junction temperature –40 150 °C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260 °C Tstg Storage temperature –65 85 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. 4 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: TPA2011D1 |
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