TS32101

Final Datasheet

Rev 2.1

January 26, 2016

www.semtech.com

9 of 12

Semtech

Recommended PCB Land Pattern

DIMENSIONSINMILLIMETERS

Units

MILLIMETERS

DimensionLimits

MIN

NOM

MAX

ContactPitch

E

0.50BSC

OptionalCenterPadWidth

W2

-

-

1.70

OptionalCenterPadLength

T2

-

-

1.70

ContactPadSpacing

C1

-

3.00

-

ContactPadSpacing

C2

-

3.00

-

ContactPadWidth(X16)

X1

-

-

0.35

ContactPadLength(X16)

Y1

-

-

0.65

DistanceBetweenPads

G

0.15

-

-

Notes:

Dimensions and tolerances per ASME Y14.5M.

BSC: Basic Dimension. Theoretically exact values shown without tolerances.

REF: Reference Dimension, usually without tolerance, for information only.

10

Specifications subject to change

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© 2012, Triune Systems, LLC

TS32101

Version 2.0

RECOMMEDED PCB LAND PATTERN

DIMENSIONS IN MILLIMETERS 

Units 

MILLIMETERS 

Dimension Limits 

MIN 

NOM 

MAX 

Contact Pitch 

E 

0.50 BSC 

Optional Center Pad Width 

W2 

-­‐ 

-­‐ 

1.70 

Optional Center Pad Length 

T2 

-­‐ 

-­‐ 

1.70 

Contact Pad Spacing 

C1 

-­‐ 

3.00 

-­‐ 

Contact Pad Spacing 

C2 

-­‐ 

3.00 

-­‐ 

Contact Pad Width (X16) 

X1 

-­‐ 

-­‐ 

0.35 

Contact Pad Length (X16) 

Y1 

-­‐ 

-­‐ 

0.65 

Distance Between Pads 

G 

0.15 

-­‐ 

-­‐ 

 

Notes: 

Dimensions and tolerances per ASME Y14.5M. 

BSC: Basic Dimension. Theoretically exact values shown without tolerances. 

REF: Reference Dimension, usually without tolerance, for information only. 

PACAKGING INFORMATION

 

Pb-Free (RoHS): The TS30011/12/13 devices are fully compliant for all materials covered by European Union Directive 2002/95/EC, and meet all IPC-

1752 Level 3 materials declaration requirements.

MSL, Peak Temp: The TS30011/12/13 family has a Moisture Sensitivity Level (MSL) 1 rating per JEDEC J-STD-020D. These devices also have a Peak

Profile Solder Temperature (Tp) of 260°C.

RECOMMENDED

LAND PATTERN

Silk Sc re e n