02139-DSH-001-D

Mindspeed Technologies

®

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Mindspeed Proprietary and Confidential

2.0 Pad Definitions

Figure 2-1.

Bare Die Layout

Table 2-1.

Pad Descriptions

Die Pad #

Name

Function

1

AGC

Monitor or force AGC voltage.

Power pin. Connect to most positive supply.

3

PINK

4

PINA

Active PIN input. Connect to photo diode anode.

Power pin. Connect to most positive supply.

6

MON

Analog current source output and rate selection function input pin. Current matched to average photodiode

current. If externally biasing the photodiode cathode the MON can be used for rate selection function only.

See Section 3.2.4 for detailed information.

7DOUT

Differential data output (goes low as light increases).

8,13

NC

No Connect. Leave floating.

9,10,11, 12

GND

14

DOUT

Differential data output (goes high as light increases).

NA

Backside

Backside. Connect to the lowest potential, usually ground.

NOTES:Notes:

1.

2.

All ground pads are common on the die. Only one ground pad needs to be connected to the TO-Can ground. However, connecting more than one

ground pad to the TO-Can ground, particularly those across the die from each other can improve performance in noisy environments.

MON

PINA

PINK

AGC

DOUT

GND

GND

1

2

3

4

56

7

13

14

DOUT

NC

9

8

10

12

11

NC