UC1846-SP

SLUS871C – JANUARY 2009 – REVISED OCTOBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage

40

V

Collector supply voltage

40

V

Analog input voltage (C/S-, C/S+, E/A+, E/A-, Shutdown)

–0.3

V

Output current, source or sink

500

mA

Reference output current

–30

mA

Sync output current

–5

mA

Error amplifier output current

–5

mA

Soft-start sink current

50

mA

Oscillator charging current

5

mA

Maximum junction temperature

150

°C

Lead temperature (soldering, 10 s)

300

°C

Storage temperature

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to ground. Currents are positive into, negative out of the specified terminal.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Operating junction temperature

–55

125

°C

6.4 Thermal Information

UC1846-SP

J (CDIP)

W (CFP)

FK (LCCC)

UNIT

16 PINS

16 PINS

20 PINS

Junction-to-ambient thermal resistance

104.2

105.2

N/A

°C/W

Junction-to-case (top) thermal resistance

N/A

N/A

N/A

°C/W

Junction-to-board thermal resistance

36.6

96.8

N/A

°C/W

Junction-to-top characterization parameter

25.0

24.0

N/A

°C/W

Junction-to-board characterization parameter

27.9

82.6

N/A

°C/W

Junction-to-case (bottom) thermal resistance

8.2

8.5

9.0

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6

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