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ADCV08832CIM Folha de dados(PDF) 3 Page - National Semiconductor (TI) |
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ADCV08832CIM Folha de dados(HTML) 3 Page - National Semiconductor (TI) |
3 / 14 page Electrical Characteristics (Continued) The following specifications apply for V CC = 3.3V, 50% Duty Cycle, and tr =tf = 20 ns unless otherwise specified. Boldface limits apply for T A =TJ =TMIN to TMAX; all other limits TA =TJ = 25˚C. Symbol Parameter Conditions Typical Limits Units Clock Duty Cycle (Note 12) 40 60 % (min) % (max) t CONV Conversion Time (Not Including MUX Addressing Time) f CLK = 500 kHz 8 16 1/f CLK µs t ca Acquisition Time 1 ⁄2 1/f CLK (max) t SET-UP Set Up Time Required from Falling CS to Rising Clock Edge 15 ns (min) t HOLD Data Input Valid after CLK Rising Edge 20 ns (min) t pd1,tpd0 CLK Falling Edge to Output Data Valid (Note 13) C L = 100 pF: Data MSB First Data LSB First 150 100 ns (max) ns (max) t 1H,t0H TRI-STATE Delay from Rising Edge of CS to Data Output and SARS Hi-Z C L = 100 pF, RL =10 kΩ (see TRI-STATE Test Circuit) 35 ns C IN Input Capacitance of CH 0,CH1 (Note 14) 13 pF C IN Input Capacitance of CLK, D1 5 pF C OUT Output Capacitance of Logic Outputs D0 (in TRI-STATE) 5pF Dynamic Characteristics The following specifications apply for V CC = 3.3V, fCLK = 500 kHz, TA= 25˚C, RSOURCE =25Ω,fIN = 9.6 kHz, VIN = 3.3VP-P, non-coherent 2048 samples. Symbol Parameter Conditions Typical Limits Units f S Sampling Rate f CLK/13 ksps SNR Signal-to-Noise Ratio (Note 16) 49.5 dB THD Total Harmonic Distortion (Note 17) −66 dB SINAD Signal-to-Noise and Distortion 49.4 dB ENOB Effective Number Of Bits (Note 15) 7.9 Bits SFDR Spurious Free Dynamic Range −67.6 dB Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Note 2: Operating Ratings indicate conditions for which the device is functional. These ratings do not guarantee specific performance limits. For guaranteed specifications and test conditions, see Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Note 3: All voltages are measured with respect to GND = 0 VDC, unless otherwise specified. Note 4: When the input voltage VIN at any pin exceeds the power supplies (VIN < (GND) or VIN > VCC,) the current at that pin should be limited to 5 mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed VCC with an input current of 5 mA to four pins. Note 5: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA and the ambient temperature, TA. The maximum allowable power dissipation at any temperature is PD =(TJMAX −TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower. Note 6: Human body model, 100 pF capacitor discharged through a 1.5 k Ω resistor. The machine mode is a 200 pF capacitor discharged directly into each pin. Note 7: Typical are at TJ = 25˚C and represent the most likely parametric norm. Note 8: Guaranteed to National’s AOQL (Average Outgoing Quality Level). Note 9: Total unadjusted error includes offset, full-scale, linearity, and multiplexer errors. Note 10: For VIN(−) ≥ VIN(+) the digital output will be 0000 0000. Two on-chip diodes are tied to each analog input (see Functional Block Diagram) which will forward-conduct for analog input voltages one diode drop below ground or one diode drop greater than VCC. During testing at low VCC levels (e.g., 2.7V), high level analog inputs (e.g., 3.3V) can cause an input diode to conduct, especially at elevated temperatures, which will cause errors for analog inputs near full-scale. The spec allows 50 mV forward bias of either diode; this means that as long as the analog VIN does not exceed the supply voltage by more than 50 mV, the output code will be correct. Exceeding the range on an unselected channel will corrupt the reading of a selected channel. Achievement of an absolute 0 VDC to 3.30 VDC input voltage range will therefore require a minimum supply voltage of 3.25 VDC over temperature variations, initial tolerance and loading. Note 11: Channel leakage current is measured after a single-ended channel is selected and the clock is turned off. For off channel leakage current the following two cases are considered: one, with the selected channel tied high (3.3VDC) and the remaining off channel tied low (0 VDC), total current flow through the off channel is measured; two, with the selected channel tied low and the off channels tied high, total current flow through the off channel is again measured. The two cases considered for determining the on channel leakage current are the same except total current flow through the selected channel is measured. Note 12: A 40% to 60% duty cycle range insures proper operation at all clock frequencies. Note 13: Since data, MSB first, is the output of the comparator used in the successive approximation loop, an additional delay is built in to allow for comparator response time. www.national.com 3 |
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