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M08A Folha de dados(PDF) 10 Page - National Semiconductor (TI) |
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M08A Folha de dados(HTML) 10 Page - National Semiconductor (TI) |
10 / 15 page Typical Performance Characteristics (Continued) Output Power vs Supply Voltage, R L =16 Ω Output Power vs Supply Voltage, R L =32 Ω 20074069 20074070 Frequency Response vs Input Capacitor Size 20074071 Application Information EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATION The LM4991’s exposed-DAP (die attach paddle) package (LD) provides a low thermal resistance between the die and the PCB to which the part is mounted and soldered. This allows rapid heat transfer from the die to the surrounding PCB copper traces, ground plane, and surrounding air. The result is a low voltage audio power amplifier that produces 2W at ≤ 1% THD with a 4Ω load. This high power is achieved through careful consideration of necessary thermal design. Failing to optimize thermal design may compromise the LM4991’s high power performance and activate unwanted, though necessary, thermal shutdown protection. The LD package must have its DAP soldered to a copper pad on the PCB. The DAP’s PCB copper pad is connected to a large plane of continuous unbroken copper. This plane forms a thermal mass, heat sink, and radiation area. Place the heat sink area on either outside plane in the case of a two-sided PCB, or on an inner layer of a board with more than two layers. Connect the DAP copper pad to the inner layer or backside copper heat sink area with 4(2x2) vias. The via diameter should be 0.012in-0.013in with a 1.27mm pitch. Ensure efficient thermal conductivity by plating through the vias. Best thermal performance is achieved with the largest prac- tical heat sink area. If the heatsink and amplifier share the same PCB layer, a nominal 2.5in 2 area is necessary for 5V operation with a 4 Ω load. Heatsink areas not placed on the same PCB layer as the LM4991 should be 5in 2 (min) for the same supply voltage and load resistance. The last two area recommendations apply for 25˚C ambient temperature. In- crease the area to compensate for ambient temperatures above 25˚C. The LM4991’s power de-rating curve in the Typical Performance Characteristics shows the maximum power dissipation versus temperature. An example PCB lay- out for the LD package is shown in the Demonstration Board Layout section. Further detailed and specific infor- mation concerning PCB layout, fabrication, and mounting an www.national.com 10 |
Nº de peça semelhante - M08A |
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Descrição semelhante - M08A |
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