SN74AHCT1G04

SCLS319P – MARCH 1996 – REVISED DECEMBER 2014

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7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Supply voltage range

–0.5

7

V

–0.5

7

V

–0.5

V

Input clamp current

–20

mA

Output clamp current

±20

mA

Continuous output current

±25

mA

±50

mA

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions() is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

7.2 ESD Ratings

VALUE

UNIT

1500

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-C101,

1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

(1)

MIN

MAX

UNIT

Supply voltage

4.5

5.5

V

High-level input voltage

2

V

Low-level Input voltage

0.8

V

Input voltage

0

5.5

V

Output voltage

0

V

High-level output current

–8

mA

Low-level output current

8

mA

Δt/Δv

Input Transition rise or fall rate

20

ns/V

Operating free-air temperature

–40

125

°C

(1)

Implications of Slow or Floating CMOS Inputs (SCBA004)

7.4 Thermal Information

SN74AHCT1G04

DBV

DCK

UNIT

5 PINS

Junction-to-ambient thermal resistance

231.3

287.6

Junction-to-case (top) thermal resistance

119.9

97.7

Junction-to-board thermal resistance

60.6

65.

°C/W

Junction-to-top characterization parameter

17.8

2.0

Junction-to-board characterization parameter

60.1

64.2

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953).

4

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