LF198-N, LF298, LF398-N

LF198A-N, LF398A-N

SNOSBI3B – JULY 2000 – REVISED NOVEMBER 2015

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6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage

±18

V

Power dissipation

500

mW

LF198-N, LF198A-N

–55

125

°C

Operating ambient temperature

LF298

–25

85

°C

LF398-N, LF398A-N

0

70

°C

Input voltage

±18

V

7

−30

V

Output short circuit duration

Indefinite

Hold capacitor short circuit duration

10

sec

H package (soldering, 10 sec.)

260

°C

N package (soldering, 10 sec.)

260

°C

Lead temperature

M package: vapor phase (60 sec.)

215

°C

Infrared (15 sec.)

220

°C

–65

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.

(3)

for the LF298, 115°C; and for the LF398-N and LF398A-N, 100°C.

(4)

Although the differential voltage may not exceed the limits given, the common-mode voltage on the logic pins may be equal to the

supply voltages without causing damage to the circuit. For proper logic operation, however, one of the logic pins must always be at least

2 V below the positive supply and 3 V above the negative supply.

6.2 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage

±15

V

LF198-N, LF198A-N

–55

125

Ambient temperature

LF298

–25

85

°C

LF398-N, LF398A-N

0

70

6.3 Thermal Information

LF398-N

LF298, LF398-N

LFx98x

P (PDIP)

D (SOIC)

LMC (TO-99)

UNIT

8 PINS

14 PINS

8 PINS

Junction-to-ambient thermal resistance

48.9

80.6

°C/W

Junction-to-case (top) thermal resistance

37.3

38.1

20

°C/W

Junction-to-board thermal resistance

26.2

35.4

—

°C/W

Junction-to-top characterization parameter

14.3

5.8

—

°C/W

Junction-to-board characterization parameter

26.0

35.1

—

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

(2)

Board mount in 400 LF/min air flow.

4

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