LM10507 datasheet(5/40 Pages) TI1

Nome de Peças	LM10507

Descrição Electrónicos	LM10507 Triple Buck LDO Power Management Unit

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Fabricante Electrônico	TI1 [Texas Instruments]

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LM10507

www.ti.com

SNVS999 – MAY 2014

7 Specifications

7.1 Absolute Maximum Ratings

(1) (2) (3)

MIN

MAX

UNIT

VIN,

-0.3

6.0

V

VIN_IO, VIN_B1, VIN_B2, VIN_B3, SPI_CS, SPI_DI, SPI_CLK, SPI_DO, ENABLE, RESET, PWR_OK,

-0.3

VIN

V

DEVSLP

Junction Temperature (TJ-MAX)

150

°C

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2)

Internal thermal shutdown protects device from permanent damage. Thermal shutdown engages at TJ = +140°C and disengages at TJ =

+120°C (typ.). Thermal shutdown is ensured by design.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

7.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

-65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

1.0

V(ESD)

Electrostatic discharge

kV

pins(1)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

(1) (2)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

VIN_B1, VIN_B2_VIN_B3, VIN

3.0

5.5

V

VIN_IO

1.75

3.63, but less than VIN

V

Junction Temperature (TJ)

-30

125

°C

Ambient Temperature (TA)

-30

85

°C

Maximum Continuous Power Dissipation (PD-MAX)

(1)

0.9

W

(1)

In applications where high power dissipation and/or poor thermal resistance is present the maximum ambient temperature may have to

be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = +125°C),

the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

(2)

The amount of Absolute Maximum power dissipation allowed for the device depends on the ambient temperature and can be calculated

using the formula: P = (TJ–TA)/θJA, where TJ is the junction temperature, TA is the ambient temperature, and θJA is the junction-to-

ambient thermal resistance.

θJA is highly application and board-layout dependent. Internal thermal shutdown circuitry protects the device

from permanent damage (see General Electrical Characteristics)

7.4 Thermal Information

THERMAL METRIC

TYP

UNIT

RθJA

Junction-to-Ambient Thermal Resistance(1)

44.5

°C/W

(1)

In applications where high power dissipation and/or poor thermal resistance is present the maximum ambient temperature may have to

be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = +125°C),

the maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the

part/package in the application (

θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

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