LM113QML, LM113QML-SP

SNVS367A – DECEMBER 2010 – REVISED APRIL 2013

www.ti.com

Schematic Diagram

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ABSOLUTE MAXIMUM RATINGS

(1)

100 mW

Reverse Current

50 mA

Forward Current

50 mA

Storage Temperature Range

Lead Temperature (Soldering, 10 seconds)

300°C

+150°C

Operating Temperature Range

Thermal Resistance

TO (Still Air)

440°C/W

TO (500LF / Min Air Flow)

TBD

CFP (Still Air)

218°C/W

CFP (500LF / Min Air Flow)

140°C/W

TO

80°C/W

CFP

27°C/W

Package Weight

TO

275mg

CFP

220mg

4000V

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the

Electrical Characteristics. Theensured specifications apply only for the test conditions listed. Some performance characteristics may

degrade when the device is not operated under the listed test conditions.

(2)

(3)

Human body model, 1.5K

Ω in series with 100pF.

2

Submit Documentation Feedback

Copyright © 2010–2013, Texas Instruments Incorporated

Product Folder Links: LM113QML LM113QML-SP

LM113QML is Obsolete