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LM3281 Folha de dados(PDF) 4 Page - Texas Instruments

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Nome de Peças LM3281
Descrição Electrónicos  3.3-V, 1.2-A, 6-MHz Miniature Step-Down DC-DC Converter
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
Logo TI1 - Texas Instruments

LM3281 Folha de dados(HTML) 4 Page - Texas Instruments

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LM3281
SNVSA38 – NOVEMBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
VIN pin to GND pin voltage
–0.2
6
V
EN, FB, MODE, SW pins to GND pin
–0.2
VIN + 0.2 or 6
voltage
(whichever is smaller)
Junction temperature (TJ)
150
°C
Continuous power dissipation(3)
Internally limited
Maximum lead temperature (soldering)
260
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
Internal thermal shutdown circuitry protects the device from permanent damage. It engages at TJ = 150°C (typ.) and disengages at TJ =
125°C (typ.).
6.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
–65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
–1000
1000
pins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification
–250
250
JESD22-C101, all pins(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VIN
Input voltage (with respect to GND pin)
3
5.5
V
ILOAD
(1)
Output current
0
1200
mA
ILOAD_BURST
(1)
Output current, short bursts (< 100 µS burst at < 10% duty cycle)
0
1400
EN
EN pin voltage (with respect to GND pin)
0
VIN
V
MODE
Mode select pin voltage (with respect to GND pin)
0
VIN
TJ
Junction temperature
–30
125
TA
Ambient temperature
–30
90
°C
TB
PC board temperature
–30
105
(1)
Refer to section High Maximum Current in this data sheet for load current use case profile.
4
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