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TL2218-285PWLE Folha de dados(PDF) 6 Page - Texas Instruments

Nome de Peças TL2218-285PWLE
Descrição Electrónicos  EXCALIBUR CURRENT-MODE SCSI TERMINATOR
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Fabricante Electrônico  TI1 [Texas Instruments]
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TL2218-285PWLE Folha de dados(HTML) 6 Page - Texas Instruments

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TL2218285, TL2218285Y
EXCALIBUR CURRENT MODE SCSI TERMINATOR
SLVS072C − DECEMBER 1992 − REVISED OCTOBER 1995
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
POST OFFICE BOX 1443
HOUSTON, TEXAS
77251−1443
8−6
THERMAL INFORMATION
The need for smaller surface-mount packages for use on compact printed-wiring boards (PWB) causes an
increasingly difficult problem in the area of thermal dissipation. In order to provide the systems designer with a better
approximation of the junction temperature rise in the thin-shrink small-outline package (TSSOP), the junction-to-lead
thermal resistance (RθJL) is provided along with the more typical values of junction-to-ambient and junction-to-case
thermal resistances, RθJA and RθJC.
RθJL is used to calculate the device junction temperature rise measured from the leads of the unit. Consequently, the
junction temperature is dependent upon the board temperature at the leads, RθJL, and the internal power dissipation
of the device. The board temperature is contingent upon several variables, including device packing density,
thickness, material, area, and number of interconnects. The RθJL value depends on the number of leads connecting
to the die-mount pad, the lead-frame alloy, area of the die, mount material, and mold compound. Since the power level
at which the TSSOP can be used is highly dependent upon both the temperature rise of the PWB and the device itself,
the systems designer can maximize this level by optimizing the circuit board. The junction temperature of the device
can be calculated using the equation TJ = (PD × RθJL) + TL where TJ = junction temperature, PD = power dissipation,
RθJL = junction-to-lead thermal resistance, and TL = board temperature at the leads of the unit.
The values of thermal resistance for the TL2218-285 PW are as follows:
Thermal Resistance
Typical Junction Rise
RθJA
151
°C/W
RθJC
31
°C/W
RθJL
50.5
°C/W
TYPICAL CHARACTERISTICS
Table of Graphs
FIGURE
IO
Output current
vs Input voltage
4
VO
Output voltage
vs Input voltage
5
IO
Output current
vs Junction temperature
6
VO
Output voltage
vs Junction temperature
7


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