LMZ21701

SNVS853D – AUGUST 2012 – REVISED NOVEMBER 2014

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7 Specifications

7.1 Absolute Maximum Ratings

Over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN

−0.3

20

V

VIN +0.3 V

EN, SS

−0.3

w/ 20 V

V

max

FB, PG, VOS

−0.3

7

V

PG sink current

10

mA

−40

125

°C

Maximum Lead Temperature

260

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

7.2 Handling Ratings

MIN

MAX

UNIT

Storage temperature range

−65

150

°C

Human body model (HBM),

−2000

2000

Electrostatic discharge

V

Charged device model (CDM),

−500

500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

(1)

Over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Input Voltage Range

3

17

V

Output Voltage Range

0.9

6.0

V

Recommended Load Current

0

1000

mA

−40

125

°C

(1)

Operating Ratings indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits.

For guaranteed specifications, see the Electrical Characteristics section.

7.4 Thermal Information

LMZ21701

SIL0008E

UNIT

8 PINS

42.6

Junction-to-case (top) thermal resistance

20.8

Junction-to-board thermal resistance

9.4

°C/W

Junction-to-top characterization parameter

1.5

Junction-to-board characterization parameter

9.3

Junction-to-case (bottom) thermal resistance

1.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

(2)

Junction-to-ambient thermal resistance (

guidelines set forth in the JEDEC standards JESD51-1 to JESD51-11.

4

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