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LM239A-EP Folha de dados(PDF) 3 Page - Texas Instruments

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Nome de Peças LM239A-EP
Descrição Electrónicos  QUAD DIFFERENTIAL COMPARATOR
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Fabricante Electrônico  TI1 [Texas Instruments]
Página de início  http://www.ti.com
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LM239A-EP Folha de dados(HTML) 3 Page - Texas Instruments

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LM239A-EP
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SCLS496C – MAY 2003 – REVISED JULY 2010
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage(2)
36
V
VID
Differential input voltage(3)
±36
V
VI
Input voltage range (either input)
–0.3
36
V
VO
Output voltage
36
V
IO
Output current
20
mA
Duration of output short circuit to ground(4)
Unlimited
qJA
Package thermal impedance, junction to free air(5) (6)
86
°C/W
TJ
Operating virtual-junction temperature
136
°C
Lead temperature 1,6 mm (1/16 in) from case for 10 s
260
°C
Tstg
Storage temperature range(7)
–65
150
°C
(1)
Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltage values, except differential voltages, are with respect to network ground.
(3)
Differential voltages are at IN+ with respect to IN–.
(4)
Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5)
Maximum power dissipation is a function of TJ (max), qJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ (max) – TA)/qJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(6)
The package thermal impedance is calculated in accordance with JESD 51-7.
(7)
Long term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of
overall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
Copyright © 2003–2010, Texas Instruments Incorporated
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