SSOP OR VSSOP PACKAGE

(TOP VIEW)

1

2

3

4

8

7

6

5

NC1

COM1

IN2

GND

COM2

IN1

NC2

YZP PACKAGE

(BOTTOM VIEW)

GND

IN1

COM2

2

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IN2

COM1

NC1

NC2

1

TS5A23167

www.ti.com

SCDS195A – MAY 2005 – REVISED SEPTEMBER 2012

0.9-

Ω DUAL SPST ANALOG SWITCH

5-V/3.3-V 2-CHANNEL ANALOG SWITCH

Check for Samples: TS5A23167

1

FEATURES

APPLICATIONS

•

•

Cell Phones

•

Low ON-State Resistance (0.9

Ω)

•

PDAs

•

Control Inputs Are 5.5-V Tolerant

•

Portable Instrumentation

•

Low Charge Injection

•

Audio and Video Signal Routing

•

Low Total Harmonic Distortion (THD)

•

Low-Voltage Data Acquisition Systems

•

1.65-V to 5.5-V Single-Supply Operation

•

Communication Circuits

•

Latch-Up Performance Exceeds 100 mA Per

•

Modems

JESD 78, Class II

•

Hard Drives

•

ESD Performance Tested Per JESD 22

•

Computer Peripherals

–

2000-V Human-Body Model(A114-B, Class

•

Wireless Terminals and Peripherals

II)

–

1000-V Charged-Device Model (C101)

DESCRIPTION/ORDERING INFORMATION

The TS5A23167 is a dual single-pole single-throw (SPST) analog switch that is designed to operate from 1.65 V

to 5.5 V. The device offers a low ON-state resistance. The device has excellent total harmonic distortion (THD)

performance and consumes very low power. These features make this device suitable for portable audio

applications.

ORDERING INFORMATION

ORDERABLE PART NUMBER

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP

Tape and reel

TS5A23167YZPR

J87

(Pb-free)

–40°C to 85°C

SSOP – DCT

Tape and reel

TS5A23167DCTR

JAP_

VSSOP – DCU (Pb-free)

Tape and reel

TS5A23167DCUR

JAP_

(1)

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at

www.ti.com/sc/package.

(2)

DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.

DCU: The acutal top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2005–2012, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.