www.onsemi.com

5

PACKAGE DIMENSIONS

SOIC−20 WB

CASE 751D−05

ISSUE H

20

1

11

10

b

20X

c

18X

A1

A

SEATING

PLANE

q

E

D

M

0.25

S

A

S

B

T

e

T

B

A

DIM

MIN

MAX

MILLIMETERS

A

2.35

2.65

A1

0.10

0.25

b

0.35

0.49

c

0.23

0.32

D

12.65

12.95

E

7.40

7.60

e

1.27 BSC

H

10.05

10.55

h

0.25

0.75

L

0.50

0.90

q

0

7

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DIMENSIONS D AND E DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF B

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

__

11.00

20X

0.52

20X

1.30

1.27

DIMENSIONS: MILLIMETERS

1

PITCH

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

RECOMMENDED

10

20

11