MC74AC377, MC74ACT377

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7

ORDERING INFORMATION

Device

Package

MC74AC377DWG

SOIC−20

(Pb−Free)

38 Units / Rail

MC74AC377DWR2G

SOIC−20

(Pb−Free)

1000 / Tape & Reel

MC74ACT377DWG

SOIC−20

(Pb−Free)

38 Units / Rail

MC74ACT377DWR2G

SOIC−20

(Pb−Free)

1000 / Tape & Reel

MC74AC377DTG

TSSOP−20

(Pb−Free)

75 Units / Rail

MC74AC377DTR2G

TSSOP−20

(Pb−Free)

2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MARKING DIAGRAMS

SOIC−20W

TSSOP−20

1

20

AC

377

ALYW

G

G

A

= Assembly Location

WL, L

= Wafer Lot

YY, Y

= Year

WW, W

= Work Week

G or

G

= Pb−Free Package

(Note: Microdot may be in either location)

1

20

ACT

377

ALYW

G

G

20

1

ACT377

AWLYYWWG

20

1

AC377

AWLYYWWG