MLX91205

IMC-Hall

®

Current Sensor (Triaxis

®

Technology)

3901091205

Page 2 of 14

Data Sheet

Rev 012

June/13

Table of Contents

1 Functional diagram......................................................................................................... 1

2 General description ........................................................................................................ 1

3 Glossary of Terms .......................................................................................................... 3

4 Maximum ratings ............................................................................................................ 3

5 Pin definitions and descriptions.................................................................................... 3

6 MLX91205 General Electrical Specifications ................................................................ 4

7 MLX91205 Sensor Specific Specifications ................................................................... 4

7.1 91205 LB: Low Field version 10mT (marking xxL) .......................................................................................................................... 4

8........................................................................................................................................... 4

8.1 91205HB: High Field version 25mT (marking xxH) ......................................................................................................................... 5

9 Detailed General Description ......................................................................................... 6

10 Unique Features............................................................................................................ 6

11 Performance Graphs .................................................................................................... 7

11.1 Offset over Temperature .............................................................................................................................................................. 7

11.2 Sensitivity over Temperature ........................................................................................................................................................ 7

12 Applications Information.............................................................................................. 8

12.1 Low current measurement up to ±2 A ........................................................................................................................................... 8

12.2 Medium current up to ±30 A ......................................................................................................................................................... 8

12.3 High current measurement up to ±600 A ...................................................................................................................................... 8

12.4 Customer Calibration with MCU.................................................................................................................................................... 9

13 Application Diagram ................................................................................................... 10

13.1 Direct Single Ended Output ........................................................................................................................................................ 10

13.2 Direct Differential Output ............................................................................................................................................................ 10

14 Standard information regarding manufacturability of Melexis products with

different soldering processes......................................................................................... 11

15 ESD Precautions ......................................................................................................... 12

16 Package Information................................................................................................... 12

16.1 Package Dimensions.................................................................................................................................................................. 12

16.2 Pinout and marking .................................................................................................................................................................... 13

16.3 Hall plate positioning .................................................................................................................................................................. 13

17 Disclaimer.................................................................................................................... 14