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ABU2516 Folha de dados(PDF) 11 Page - Advanced Semiconductor Business Inc. |
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ABU2516 Folha de dados(HTML) 11 Page - Advanced Semiconductor Business Inc. |
11 / 12 page 11/12 ASB Inc. sales@asb.co.kr September 2017 ABU2516 6. Package Outline (SOIC8) \ 7. Surface Mount Recommendation (In mm) Symbols Dimensions (In mm) MIN NOM MAX A 1.40 1.50 1.60 A1 0.00 --- 0.10 A2 --- 1.45 --- B 0.33 --- 0.51 C 0.19 --- 0.25 D 4.80 --- 5.00 D2 3.20 3.30 3.40 E 5.80 6.00 6.20 E1 3.80 3.90 4.00 E2 2.30 2.40 2.50 e --- 1.27 --- L 0.40 --- 1.27 y --- --- 0.10 0 --- 8 L1-L1 --- --- 0.12 L1 1.04REF NOTE 1. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 2. To ensure reliable operation, device ground paddle-to-ground pad soldering is critical. 3. Add mounting screws near the part to fasten the board to a heat sinker. Ensure that the ground & thermal via region contacts the heat sinker. 4. A proper heat dissipation path underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can result from inappropriate heat dissipation. le is RF and DC ground. Part No. |
Nº de peça semelhante - ABU2516 |
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Descrição semelhante - ABU2516 |
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