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DRV5011 Folha de dados(PDF) 24 Page - Texas Instruments |
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DRV5011 Folha de dados(HTML) 24 Page - Texas Instruments |
24 / 27 page www.ti.com PACKAGE OUTLINE C 4X 0.27 0.17 0.8±0.05 4X 0.25 0.15 0.6±0.05 0.05 0.00 0.4 MAX 2X 0.5 A 1.45 1.35 B 1.15 1.05 X2SON - 0.4 mm max height DMR0004A PLASTIC SMALL OUTLINE - NO LEAD 4222825/A 03/2016 PIN 1 INDEX AREA SEATING PLANE 0.08 C 1 2 3 4 (OPTIONAL) PIN 1 ID 0.1 C B A 0.05 C EXPOSED THERMAL PAD 5 SYMM SYMM NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. SCALE 9.000 |
Nº de peça semelhante - DRV5011 |
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Descrição semelhante - DRV5011 |
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