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Os motores de busca de Datasheet de Componentes eletrônicos |
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Os motores de busca de Datasheet de Componentes eletrônicos |
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FDC796N Folha de dados(PDF) 2 Page - Fairchild Semiconductor |
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FDC796N Folha de dados(HTML) 2 Page - Fairchild Semiconductor |
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2 / 6 page  FDC796N Rev D (W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = 250 µA 30 V ∆BVDSS ∆TJ Breakdown Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C 25 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = 24 V, VGS = 0 V 10 µA IGSS Gate–Body Leakage VGS = ± 20 V, VDS = 0 V ±100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 1 2 3 V ∆VGS(th) ∆TJ Gate Threshold Voltage Temperature Coefficient ID = 250 µA, Referenced to 25°C – 5.6 mV/ °C RDS(on) Static Drain–Source On Resistance VGS = 10 V, ID = 12.5 A VGS = 4.5 V, ID = 11 A VGS = 10 V, ID = 12.5 A, TJ=125°C 7.4 9.5 9 9 12 16 m Ω gFS Forward Transconductance VDS = 10 V, ID = 12.5 A 48.4 S Dynamic Characteristics Ciss Input Capacitance 1444 pF Coss Output Capacitance 342 pF Crss Reverse Transfer Capacitance VDS = 15 V, V GS = 0 V, f = 1.0 MHz 135 pF RG Gate Resistance VGS = 15 mV, f = 1.0 MHz 1.25 Ω Switching Characteristics (Note 2) td(on) Turn–On Delay Time 10 20 ns tr Turn–On Rise Time 3.8 7.6 ns td(off) Turn–Off Delay Time 26 42 ns tf Turn–Off Fall Time VDD = 15 V, ID = 1 A, VGS = 10 V, RGEN = 6 Ω 13 23 ns Qg Total Gate Charge 14 20 nC Qgs Gate–Source Charge 4 nC Qgd Gate–Drain Charge VDS = 15 V, ID = 12.5 A, VGS = 5 V 5 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current 1.5 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = 1.5 A (Note 2) 0.73 1.2 V trr Diode Reverse Recovery Time 25 nS Qrr Diode Reverse Recovery Charge IF = 12.5 A, diF/dt = 100 A/µs 15 nC Notes: 1. R θJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θJC is guaranteed by design while RθCA is determined by the user's board design. a) 60°C/W when mounted on a 1in 2 pad of 2 oz copper b) 111°C/W when mounted on a minimum pad of 2 oz copper Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0% |
Nº de peça semelhante - FDC796N |
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Descrição semelhante - FDC796N |
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