REV. D

AD8001

–3–

ABSOLUTE MAXIMUM RATINGS

1

Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V

Internal Power Dissipation @ 25

PDIP Package (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W

SOIC (R) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.8 W

8-Lead CERDIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.1 W

SOT-23-5 Package (RT) . . . . . . . . . . . . . . . . . . . . . . . 0.5 W

Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .

Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . .

±1.2 V

Output Short Circuit Duration

.. . . . . . . . . . . . . . . . . . . . .Observe Power Derating Curves

Storage Temperature Range N, R . . . . . . . . . –65

°C to +125°C

Operating Temperature Range (A Grade) . . . – 40

°C to +85°C

Lead Temperature Range (Soldering 10 sec) . . . . . . . . . 300

°C

NOTES

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

8-Lead PDIP Package:

θ

°C/W

8-Lead SOIC Package:

θ

°C/W

8-Lead CERDIP Package:

θ

°C/W

5-Lead SOT-23-5 Package:

θ

°C/W

MAXIMUM POWER DISSIPATION

The maximum power that can be safely dissipated by the

AD8001 is limited by the associated rise in junction tempera-

ture. The maximum safe junction temperature for plastic

encapsulated devices is determined by the glass transition tem-

perature of the plastic, approximately 150

°C. Exceeding this

limit temporarily may cause a shift in parametric performance

due to a change in the stresses exerted on the die by the package.

Exceeding a junction temperature of 175

°C for an extended

period can result in device failure.

While the AD8001 is internally short circuit protected, this

may not be sufficient to guarantee that the maximum junction

temperature (150

°C) is not exceeded under all conditions. To

ensure proper operation, it is necessary to observe the maximum

power derating curves.

2.0

0

–50

80

1.5

0.5

–40

1.0

010

–10

–20

–30

20

30

40

50

60

70

90

AMBIENT TEMPERATURE – C

8-LEAD

PDIP PACKAGE

5-LEAD

SOT-23-5 PACKAGE

8-LEAD

SOIC PACKAGE

8-LEAD

CERDIP PACKAGE

Figure 3. Plot of Maximum Power Dissipation vs.

Temperature

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection.

Although the AD8001 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD

precautions are recommended to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

ORDERING GUIDE

Temperature

Package

Package

Model

Range

Description

Option

Branding

AD8001AN

–40

°C to +85°C

8-Lead PDIP

N-8

AD8001AQ

–55

°C to +125°C

8-Lead CERDIP

Q-8

AD8001AR

–40

°C to +85°C

8-Lead SOIC

R-8

AD8001AR-REEL

–40

°C to +85°C

13" Tape and REEL

R-8

AD8001AR-REEL7

–40

°C to +85°C

7" Tape and REEL

R-8

AD8001ART-REEL

–40

°C to +85°C

13" Tape and REEL

RT-5

HEA

AD8001ART-REEL7

–40

°C to +85°C

7" Tape and REEL

RT-5

HEA

AD8001ACHIPS

–40

°C to +85°CDie Form

5962-9459301MPA

*

–55

°C to +125°C

8-Lead CERDIP

Q-8