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ML13135 Folha de dados(PDF) 11 Page - LANSDALE Semiconductor Inc.

Nome de Peças ML13135
Descrição Electrónicos  FM Communications Receiver
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Fabricante Electrônico  LANSDALE [LANSDALE Semiconductor Inc.]
Página de início  http://www.lansdale.com
Logo LANSDALE - LANSDALE Semiconductor Inc.

ML13135 Folha de dados(HTML) 11 Page - LANSDALE Semiconductor Inc.

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Page 11 of 11
Issue 0
LANSDALE Semiconductor, Inc.
ML13135
OUTLINE DIMENSIONS
P DIP 24 = LP
PLASTIC PACKAGE
(ML13135LP)
CASE 724–03
ISSUE D
SO 24 = -6P
PLASTIC PACKAGE
(ML13135-6P)
CASE 751E–04
ISSUE E
MIN
MIN
MAX
MAX
INCHES
MILLIMETERS
DIM
1.265
0.270
0.175
0.020
0.060
0.012
0.140
15
°
0.040
0.050 BSC
0.100 BSC
0.300 BSC
1.27 BSC
2.54 BSC
7.62 BSC
A
B
C
D
E
F
G
J
K
L
M
N
31.25
6.35
3.69
0.38
1.02
0.18
2.80
0
°
0.51
32.13
6.85
4.44
0.51
1.52
0.30
3.55
15
°
1.01
1.230
0.250
0.145
0.015
0.040
0.007
0.110
0
°
0.020
NOTES:
1. CHAMFERED CONTOUR OPTIONAL.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
1
12
13
24
–A–
–B–
C
K
N
–T–
SEATING
PLANE
G
E
F
D 24 PL
J 24 PL
M
NOTE 1
L
0.25 (0.010)
T A
M
M
0.25 (0.010)
T B
M
M
T
0.010 (0.25)
A
B
M
S
S
MIN
MIN
MAX
MAX
MILLIMETERS
INCHES
DIM
A
B
C
D
F
G
J
K
M
P
R
15.25
7.40
2.35
0.35
0.41
0.23
0.13
0
°
10.05
0.25
15.54
7.60
2.65
0.49
0.90
0.32
0.29
8
°
10.55
0.75
0.601
0.292
0.093
0.014
0.016
0.009
0.005
0
°
0.395
0.010
0.612
0.299
0.104
0.019
0.035
0.013
0.011
8
°
0.415
0.029
1.27 BSC
0.050 BSC
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN
EXCESS OF D DIMENSION AT MAXIMUM
MATERIAL CONDITION.
–A–
–B–
1
12
24
13
–T–
C
K
SEATING
PLANE
R X 45°
G 22 PL
P 12 PL
0.010 (0.25)
B
M
M
F
J
M
D 24 PL
Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili-
ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit
described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which
may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s
technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc.


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