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Os motores de busca de Datasheet de Componentes eletrônicos |
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Os motores de busca de Datasheet de Componentes eletrônicos |
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QXXXXLTX Folha de dados(PDF) 6 Page - Littelfuse |
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QXXXXLTX Folha de dados(HTML) 6 Page - Littelfuse |
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6 / 8 page  © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 12/14/14 Teccor® brand Thyristors 4 / 6 / 8 / 10 / 15 Amp Quadracs Soldering Parameters Reflow Condition Pb–Freeassembly Pre Heat -Temperature Min (T s(min)) 150°C -Temperature Max (T s(max)) 200°C -Time (min to max) (t s) 60 – 180 secs Average ramp up rate (LiquidusTemp) (T L) to peak 5°C/second max T S(max) to TL - Ramp-up Rate 5°C/second max Reflow -Temperature (T L) (Liquidus) 217°C -Temperature (t L) 60 – 150 seconds PeakTemperature (T P) 260+0/-5 °C Time within 5°C of actual peak Temperature (t p) 20 – 40 seconds Ramp-down Rate 5°C/second max Time 25°C to peakTemperature (T P) 8 minutes Max. Do not exceed 280°C Environmental Specifications Test Specifications and Conditions High Temperature Voltage Blocking MIL-STD-750: Method 1040, Condition A Rated V DRM (VAC-peak), 125°C, 1008 hours Temperature Cycling MIL-STD-750: Method 1051 -40°C to 150°C, 15-minute dwell, 100 cycles Biased Temperature & Humidity EIA/JEDEC:JESD22-A101 320VDC,85°C,85%RH,1008hours High Temp Storage MIL-STD-750: Method 1031 150°C, 1008 hours Low-Temp Storage -40°C, 1008 hours Thermal Shock MIL-STD-750: Method 1056 0°C to 100°C, 5-minute dwell, 10-second transfer, 10 cycles Autoclave (Pressure Cooker Test) EIA/JEDEC:JESD22-A102 121°C,100%RH,2atm,168hours Resistance to Solder Heat MIL-STD-750: Method 2031 260°C, 10 seconds Solderability ANSI/J-STD-002,Category3,TestA Lead Bend MIL-STD-750:Method2036,ConditionE Physical Specifications Terminal Finish 1005 Matte Tin-plated Body Material ULRecognizedepoxymeeting flammabilityclassification94v-0 Lead Material Copper Alloy Design Considerations Careful selection of the correct device for the application’s operating parameters and environment will go a long way toward extending the operating life of the Thyristor. Good design practice should limit the maximum continuous current through the main terminals to 75% of the device rating.Otherwaystoensurelonglifeforapowerdiscrete semiconductor are proper heat sinking and selection of voltageratingsforworstcaseconditions.Overheating, overvoltage (including dv/dt), and surge currents are the main killers of semiconductors. Correct mounting, soldering, and forming of the leads also help protect against component damage. Time TP TL TS(max) TS(min) 25 tP tL tS time to peak temperature Preheat Preheat Ramp-up Ramp-up Ramp-down Ramp-do |
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Descrição semelhante - QXXXXLTX |
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