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BTS3080EJ Folha de dados(PDF) 11 Page - Infineon Technologies AG

Nome de Peças BTS3080EJ
Descrição Electrónicos  Smart Low-Side Power Switch
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Fabricante Electrônico  INFINEON [Infineon Technologies AG]
Página de início  http://www.infineon.com
Logo INFINEON - Infineon Technologies AG

BTS3080EJ Folha de dados(HTML) 11 Page - Infineon Technologies AG

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Datasheet
11
Rev. 1.0
2016-09-12
HITFET - BTS3080EJ
Smart Low-Side Power Switch
General Product Characteristics
4.3
Thermal Resistance
Note:
This thermal data was generated in accordance with JEDEC JESD51 standards.
For more information, go to www.jedec.org.
4.3.1
PCB set up
The following PCB set up was implemented to determine the transient thermal impedance1)
Figure 4
Cross section JEDEC2s2p
Table 4
Thermal Resistance PG-TDSO8-31
Parameter
Symbol
Values
Unit
Note or
Test Condition
Number
Min.
Typ.
Max.
Junction to Soldering Point
RthJSP
–4.1
–K/W
1) 2)
1) Not subject to production test, specified by design
2) Specified RthJSP value is simulated at natural convection on a cold plate setup (all pins are fixed to ambient
temperature).
TA = 85°C. Device is loaded with 1 W power.
P_4.3.5
Junction to Ambient (2s2p)
RthJA(2s2p)
37
K/W
1) 3)
3) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board;
The product (Chip + Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70 µm
Cu, 2 x 35 µm Cu). Where applicable a thermal via array under the ex posed pad contacted the first inner copper layer.
TA = 85°C, Device is loaded with 1 W power.
P_4.3.11
Junction to Ambient
(1s0p+600 mm2 Cu)
RthJA(1s0p) –48
K/W
1) 4)
4) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 1s0p board;
The product (Chip + Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with additional heatspreading copper
area of 600 mm2 and 70 µm thickness. TA = 85°C, Device is loaded with 1 W power.
P_4.3.17
Junction to Ambient
(1s0p+300 mm2 Cu)
RthJA(1s0p) –58
K/W
1) 5)
5) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 1s0p board;
The product (Chip + Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with additional heatspreading copper
area of 300 mm2 and 70 µm thickness. TA = 85°C, Device is loaded with 1 W power.
P_4.3.23
1) (*) means percentual Cu metalization on each layer
 
70µm modelled (traces)
35µm, 100% metalization*
70µm, 5% metalization*


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