Data Sheet D16181EJ1V0DS

6

FP1 SERIES

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, contact an NEC sales representative.

Surface MOUNTING TYPE

For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting

Technology Manual (C10535E).

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* After opening the dry pack, store it at 25

°C or less and 65% RH or less for the allowable storage period.

Cautions 1. Do not use different soldering methods together (except for partial heating).

2. Prevent the resin surface temperature from being higher than the board temperature by 20

°°°°C or

more.