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HCPL-J454 Folha de dados(PDF) 8 Page - Agilent(Hewlett-Packard) |
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HCPL-J454 Folha de dados(HTML) 8 Page - Agilent(Hewlett-Packard) |
8 / 20 page 8 Insulation and Safety Related Specifications Value Parameter Symbol Units Conditions HCPL-4504 HCPL-J454 HCPL-0454 HCNW4504 Minimum External L(101) 7.1 7.4 4.9 9.6 mm Measured from input Air Gap (External terminals to output Clearance) terminals, shortest distance through air. Minimum External L(102) 7.4 8.0 4.8 10.0 mm Measured from input Tracking (External terminals to output Creepage) terminals, shortest distance path along body. Minimum Internal 0.08 0.5 0.08 1.0 mm Through insulation Plastic Gap distance, conductor (Internal Clearance) to conductor, usually the direct distance between the photoemitter and photodetector inside the optocoupler cavity. Minimum Internal NA NA NA 4.0 mm Measured from input Tracking (Internal terminals to output Creepage) terminals, along internal cavity. Tracking Resistance CTI ≥ 175 ≥ 175 ≥ 175 ≥ 200 Volts DIN IEC 112/VDE (Comparative 0303 Part 1 Tracking Index) Isolation Group IIIa IIIa IIIa IIIa Material Group (DIN VDE 0110, 1/89, Table 1) All Agilent data sheets report the creepage and clearance inherent to the optocoupler component itself. These dimensions are needed as a starting point for the equipment designer when determining the circuit insulation requirements. However, once mounted on a printed circuit board, minimum creepage and clearance requirements must be met as specified for individual equipment standards. For creepage, the shortest distance path along the surface of a printed circuit board between the solder fillets of the input and output leads must be considered. There are recommended techniques such as grooves and ribs which may be used on a printed circuit board to achieve desired creepage and clearances. Creepage and clearance distances will also change depending on factors such as pollution degree and insulation level. |
Nº de peça semelhante - HCPL-J454 |
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Descrição semelhante - HCPL-J454 |
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