CX805-30 BASEBAND PROCESSOR PRODUCT SUMMARY

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

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June 21, 2005 • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice. • 103171D

Figure 3. 180-pin FPBGA and Lead-free 180-pin Lead-free FPBGA Package Dimensions

10 x 10 FPBGA - 180 Balls/ 0.50 mm Pitch

NOTES:

1. All dimensions are in millimeter

2. For die orientation see appropriate bonding diagram

3. FPBGA Lands are solder mask defined

4. Minimum solder pitch is 0.50 mm

5. Dimensioning and tolerancing in accordance with ASME Y14.5 M - 1994

A1 Ball Pad Corner

2

8

1

3

4

5

6

7

14

13

12

11

10

9

18 16

17 15

C

J

A

G

E

L

N

R

U

D

K

B

H

F

M

P

T

V

0.25

0.5

0.25

0.5

10.00 ± 0.10

10.00±0.10

Pin 1 Indicator

1.4 MAX

0.25 ± 0.05

Ø0.3 ± 0.05 TYP

Mold

Seating Plane