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BD9P105MUF-CE2 Folha de dados(PDF) 9 Page - Rohm

Nome de Peças BD9P105MUF-CE2
Descrição Electrónicos  3.5 V to 40 V Input, 1 A Single 2.2 MHz Buck DC/DC Converter For Automotive
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© 2019 ROHM Co., Ltd. All rights reserved.
28.Apr.2020 Rev.001
www.rohm.com
TSZ22111 • 15 • 001
BD9P1x5MUF-C Series
TSZ02201-0J1J0AL01500-1-2
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Input Voltage
VVIN, VPVIN
-
0.3 to +42
V
EN Voltage
VEN
-
0.3 to +42
V
BST Voltage
VBST
-
0.3 to +49
V
Voltage from SW to BST
ΔVBST
VSW -0.3 to VSW +7
V
FB, RESET, MODE,
SSCG, OCP_SEL Voltage
VFB, VRESET,
VMODE, VSSCG
VOCP_SEL
-
0.3 to +7
V
VOUT_DIS Voltage
VVOUT_DIS
-
0.3 to +10
V
VOUT_SNS Voltage
VVOUT_SNS
-
0.3 to +10
V
VCC_EX Voltage
VVCC_EX
-
0.3 to +7
V
VREG Voltage
VREG
-
0.3 to +7
V
Storage Temperature Range
Tstg
-
55 to +150
˚C
Maximum Junction Temperature
Tjmax
150
˚C
Human Body Model (HBM)(Note 1)
VESD_HBM
±2
kV
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by
increasing board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) These voltages are guaranteed by design. Not tested.
Thermal Resistance(Note 2)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 4)
2s2p(Note 5)
VQFN20FV4040
Junction to Ambient
θJA
120.0
38.7
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT
15
8
°C/W
(Note 2) Based on JESD51-2A(Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
Board Size
Thermal Via(Note 6)
Pitch
Diameter
4 Layers
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
1.20 mm
Φ0.30 mm
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 6) This thermal via connects with the copper pattern of all layers.


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