Os motores de busca de Datasheet de Componentes eletrônicos
Selected language     Portuguese  ▼

Delete All


Preview PDF Download HTML

BD9P105MUF-CE2 Folha de dados(PDF) 53 Page - Rohm

Nome de Peças. BD9P105MUF-CE2
descrição  3.5 V to 40 V Input, 1 A Single 2.2 MHz Buck DC/DC Converter For Automotive
Download  60 Pages
Scroll/Zoom Zoom In 100% Zoom Out
Fbricantes  ROHM [Rohm]
Página de início  http://www.rohm.com
Logo ROHM - Rohm

BD9P105MUF-CE2 Folha de dados(HTML) 53 Page - Rohm

Back Button BD9P105MUF-CE2 Datasheet HTML 49Page - Rohm BD9P105MUF-CE2 Datasheet HTML 50Page - Rohm BD9P105MUF-CE2 Datasheet HTML 51Page - Rohm BD9P105MUF-CE2 Datasheet HTML 52Page - Rohm BD9P105MUF-CE2 Datasheet HTML 53Page - Rohm BD9P105MUF-CE2 Datasheet HTML 54Page - Rohm BD9P105MUF-CE2 Datasheet HTML 55Page - Rohm BD9P105MUF-CE2 Datasheet HTML 56Page - Rohm BD9P105MUF-CE2 Datasheet HTML 57Page - Rohm Next Button
Zoom Inzoom in Zoom Outzoom out
 53 / 60 page
background image
© 2019 ROHM Co., Ltd. All rights reserved.
28.Apr.2020 Rev.001
TSZ22111 • 15 • 001
BD9P1x5MUF-C Series
Operational Notes
Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power
supply pins.
Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Furthermore, connect a capacitor to ground at
all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic
Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However,
pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground
due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below
ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions
such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few.
Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
Recommended Operating Conditions
The function and operation of the IC are guaranteed within the range specified by the recommended operating
conditions. The characteristic values are guaranteed only under the conditions of each item specified by the electrical
Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge
acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause
unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power
supply or ground line.

Html Pages

1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24  25  26  27  28  29  30  31  32  33  34  35  36  37  38  39  40  41  42  43  44  45  46  47  48  49  50  51  52  53  54  55  56  57  58  59  60 

Datasheet Download

Go To PDF Page

Ligação URL

Privacy Policy
ALLDATASHEET é util para você?  [ DONATE ]  

Sobre Alldatasheet   |   Publicidade   |   Contato conosco   |   Política de Privacidade   |   Troca de Link   |   Lista de Fabricantes
All Rights Reserved© Alldatasheetpt.com

Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn