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BD77501G Folha de dados(PDF) 5 Page - Rohm

Nome de Peças BD77501G
Descrição Electrónicos  High Speed Ground Sense Excellent EMI Characteristics CMOS Operational Amplifier
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Fabricante Electrônico  ROHM [Rohm]
Página de início  http://www.rohm.com
Logo ROHM - Rohm

BD77501G Folha de dados(HTML) 5 Page - Rohm

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BD77501G BD77502FVM BD77504FV
© 2019 ROHM Co., Ltd. All rights reserved.
30.Oct.2020 Rev.003
www.rohm.com
TSZ22111 • 15 • 001
TSZ02201-0GFG2G500010-1-2
Absolute Maximum Ratings (Ta = 25 °C)
Parameter
Symbol
Rating
Unit
Supply Voltage
VDD-VSS
15.5
V
Differential Input Voltage(Note 1)
VID
VDD-VSS
V
Common-mode Input Voltage Range
VICMR
(VSS - 0.3) to (VDD + 0.3)
V
Input Current
II
±10
mA
Maximum Junction Temperature
Tjmax
150
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Caution 1: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operate over the absolute maximum ratings.
Caution 2: Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the
properties of the chip. In case of exceeding this absolute maximum rating, design a PCB with thermal resistance taken into consideration by increasing
board size and copper area so as not to exceed the maximum junction temperature rating.
(Note 1) The differential input voltage indicates the voltage difference between inverting input and non-inverting input.
The input pin voltage is set to VSS or more.
Thermal Resistance(Note 2)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 4)
2s2p(Note 5)
SSOP5
Junction to Ambient
θJA
376.5
185.4
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT
40
30
°C/W
MSOP8
Junction to Ambient
θJA
284.1
135.4
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT
21
11
°C/W
SSOP-B14
Junction to Ambient
θJA
159.6
92.8
°C/W
Junction to Top Characterization Parameter(Note 3)
ΨJT
13
9
°C/W
(Note 2) Based on JESD51-2A (Still-Air).
(Note 3) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface
of the component package.
(Note 4) Using a PCB board based on JESD51-3.
(Note 5) Using a PCB board based on JESD51-7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
Board Size
4 Layers
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Operating Supply Voltage
VDD
7.0
±3.5
12.0
±6.0
15.0
±7.5
V
Operating Temperature
Topr
-40
+25
+85
°C
Output Load Capacitance(Note 6)
CL
-
0.01
-
nF
(Note 6) This parameter obtained VDD = 12 V. Not 100 % tested.


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