4

FMM5116X

20-32GHz Upconverter MMIC

CHIP OUTLINE

0

190

460

1690

1775

2045

2260

0190

1195

2135 2300

2865 3085

LO

RF

IF

Chip Size: 3.085mm x 2.26mm

Chip Thickness: 110

µm (Typ.)

Pad Dimensions: 1. RF: 80 x 160

µm

4. LO: 80 x 160

µm

6. IF: 80 x 120

µm

Unit:

µm

Fujitsu Compound Semiconductor Products contain gallium arsenide

(GaAs) which can be hazardous to the human body and the environment.

For safety, observe the following procedures:

• Do not put this product into the mouth.

• Do not alter the form of this product into a gas, powder,

or liquid through burning, crushing, or chemical processing

as these by-products are dangerous to the human body

if inhaled, ingested, or swallowed.

• Observe government laws and company regulations

when discarding this product. This product must be

discarded in accordance with methods specified

by applicable hazardous waste procedures.

CAUTION

FUJITSU QUANTUM DEVICES LIMITED

Business Development Division

11th Floor, Hachioji Daiichi-Seimei Bldg.

3-20-6 Myojin-cho

Hachioji-city, Tokyo 192-0046, Japan

TEL: +81-426-43-5885

FAX: +81-426-43-5582

For further information please contact:

F

UJITSU COMPOUND SEMICONDUCTOR, INC.

2355 Zanker Rd.

San Jose, CA 95131-1138, U.S.A.

Phone: (408) 232-9500

FAX: (408) 428-9111

www.fcsi.fujitsu.com

FUJITSU QUANTUM DEVICES EUROPE LTD.

Network House

Norreys Drive

Maidenhead, Berkshire SL6 4FJ

United Kingdom

TEL: +44 (0) 1628 504800

FAX: +44 (0) 1628 504888

FUJITSU QUANTUM DEVICES

SINGAPORE PTE LTD.

Hong Kong Branch

Rm. 1101, Ocean Centre, 5 Canton Rd. Tsim Sha Tsui,

Kowloon, Hong Kong

TEL: +852-23770226

FAX: +852-23763269

Fujitsu Limited reserves the right to change products and specifications without notice.

The information does not convey any license under rights of Fujitsu Limited or others.

© 2003 FUJITSU COMPOUND SEMICONDUCTOR, INC.

Printed in U.S.A. FCSI0502M200