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SS26 Datasheet(Folha de dados) 2 Page - ON Semiconductor

Nome de Peças. SS26
descrição  Surface Mount Schottky Power Rectifier
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Fbricantes  ONSEMI [ON Semiconductor]
Página de início  http://www.onsemi.com
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SS26
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THERMAL CHARACTERISTICS
Characteristic
Symbol
Value
Unit
Thermal Resistance − Junction−to−Lead (Note 1)
Thermal Resistance − Junction−to−Ambient (Note 2)
RqJL
RqJA
24
80
°C/W
1. Mounted with minimum recommended pad size, PC Board FR4.
2. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.
ELECTRICAL CHARACTERISTICS
Value
Characteristic
Symbol
TJ = 25°C
TJ = 125°C
Unit
Maximum Instantaneous Forward Voltage (Note 3)
(iF = 1.0 A)
(iF = 2.0 A)
vF
0.51
0.63
0.475
0.55
V
Maximum Instantaneous Reverse Current (Note 3)
(VR = 60 V)
IR
0.2
10
mA
3. Pulse Test: Pulse Width ≤ 250 ms, Duty Cycle ≤ 2.0%.
Figure 1. Typical Forward Voltage
0.1
0.2
0.4
0.7
0.6
10
0.1
1
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 2. Maximum Forward Voltage
0.2
0.8
0.4
0.6
0.3
0.5
10
0.1
1
VF, INSTANTANEOUS FORWARD VOLTAGE (V)
Figure 3. Typical Reverse Current
10
30
02040
VR, REVERSE VOLTAGE (V)
Figure 4. Typical Capacitance
75°C
25°C
1.0E−02
125°C
75°C
25°C
10
30
020
40
10
VR, REVERSE VOLTAGE (V)
0.3
0.5
0.8
125°C
75°C
25°C
125°C
60
50
50
60
100
0.7
0.1
1.0E−03
1.0E−04
1.0E−05
1.0E−06
1.0E−07
25°C
f = 1 MHz




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