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H01N60SJ Folha de dados(PDF) 4 Page - Hi-Sincerity Mocroelectronics |
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H01N60SJ Folha de dados(HTML) 4 Page - Hi-Sincerity Mocroelectronics |
4 / 5 page HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : MOS200501 Issued Date : 2005.01.01 Revised Date : 2005.09.28 Page No. : 4/5 H01N60SI, H01N60SJ HSMC Product Specification TO-251 Dimension Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: • Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 • Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 a1 A F G a2 K1 K 3 2 1 C a1 M L Tab H1 a2 A B C D E a1 F G H H1 K J a2 a2 K1 y2 y2 M a1 y1 a1 y1 y1 I Marking: Control Code Date Code HI 01 Pb Free Mark Pb-Free: " . " (Note) Normal: None N6 0 S Note: Green label is used for pb-free packing Pin Style: 1.Gate 2.Drain 3.Source Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 3-Lead TO-251 Plastic Package HSMC Package Code: I DIM Min. Max. A 6.35 6.80 C 4.80 5.50 F 1.30 1.70 G 5.40 6.25 H1 6.75 8.00 K 0.50 0.90 K1 0.40 0.90 L 0.90 1.50 M 2.20 2.40 a1 0.40 0.65 a2 - *2.30 *: Typical, Unit: mm 3-Lead TO-251 Plastic Package HSMC Package Code: I Marking: Control Code Date Code HI 01 Pb Free Mark Pb-Free: " . " (Note) Normal: None N 0 6S Note: Green label is used for pb-free packing Pin Style: 1.Gate 2.Drain 3.Source Material: • Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 DIM Min. Max. A 6.40 6.80 B - 6.00 C 5.04 5.64 D- *4.34 E 0.40 0.80 F 0.50 0.90 G 5.90 6.30 H- *1.80 H1 - *9.30 I - *16.10 J- *0.80 K - 0.96 K1 - *0.76 M 2.20 2.40 a1 0.40 0.60 a2 2.10 2.50 y1 - 5o y2 - 3o *: Typical, Unit: mm |
Nº de peça semelhante - H01N60SJ |
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Descrição semelhante - H01N60SJ |
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