Os motores de busca de Datasheet de Componentes eletrônicos
  Portuguese  ▼
ALLDATASHEETPT.COM

X  

74LVC32245A Folha de dados(PDF) 11 Page - NXP Semiconductors

Nome de Peças 74LVC32245A
Descrição Electrónicos  32-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Download  16 Pages
Scroll/Zoom Zoom In 100%  Zoom Out
Fabricante Electrônico  PHILIPS [NXP Semiconductors]
Página de início  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

74LVC32245A Folha de dados(HTML) 11 Page - NXP Semiconductors

Back Button 74LVC32245A Datasheet HTML 7Page - NXP Semiconductors 74LVC32245A Datasheet HTML 8Page - NXP Semiconductors 74LVC32245A Datasheet HTML 9Page - NXP Semiconductors 74LVC32245A Datasheet HTML 10Page - NXP Semiconductors 74LVC32245A Datasheet HTML 11Page - NXP Semiconductors 74LVC32245A Datasheet HTML 12Page - NXP Semiconductors 74LVC32245A Datasheet HTML 13Page - NXP Semiconductors 74LVC32245A Datasheet HTML 14Page - NXP Semiconductors 74LVC32245A Datasheet HTML 15Page - NXP Semiconductors Next Button
Zoom Inzoom in Zoom Outzoom out
 11 / 16 page
background image
1999 Sep 01
11
Philips Semiconductors
Product specification
32-bit bus transceiver with direction pin;
5 V tolerant; 3-state
74LVC32245A;
74LVCH32245A
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250
°C. The top-surface temperature of the
packages should preferable be kept below 230
°C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45
° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250
°C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300
°C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320
°C.


Nº de peça semelhante - 74LVC32245A

Fabricante ElectrônicoNome de PeçasFolha de dadosDescrição Electrónicos
logo
NXP Semiconductors
74LVC32245A NXP-74LVC32245A Datasheet
88Kb / 12P
   32-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 01-20 August 2007
logo
Nexperia B.V. All right...
74LVC32245A NEXPERIA-74LVC32245A Datasheet
984Kb / 14P
   32-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 3 - 16 December 2011
logo
NXP Semiconductors
74LVC32245AEC NXP-74LVC32245AEC Datasheet
88Kb / 12P
   32-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 01-20 August 2007
logo
Nexperia B.V. All right...
74LVC32245AEC NEXPERIA-74LVC32245AEC Datasheet
984Kb / 14P
   32-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 3 - 16 December 2011
logo
NXP Semiconductors
74LVC32245A PHILIPS-74LVC32245A_15 Datasheet
162Kb / 14P
   32-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 3-16 December 2011
More results

Descrição semelhante - 74LVC32245A

Fabricante ElectrônicoNome de PeçasFolha de dadosDescrição Electrónicos
logo
NXP Semiconductors
74LVC32245A PHILIPS-74LVC32245A_15 Datasheet
162Kb / 14P
   32-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 3-16 December 2011
74LVC32245A NXP-74LVC32245A Datasheet
88Kb / 12P
   32-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 01-20 August 2007
74LVCH32245A NXP-74LVCH32245A Datasheet
93Kb / 13P
   32-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 03-20 August 2007
74LVCH32245A PHILIPS-74LVCH32245A_15 Datasheet
175Kb / 15P
   32-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 5-15 December 2011
logo
Nexperia B.V. All right...
74LVC32245A NEXPERIA-74LVC32245A Datasheet
984Kb / 14P
   32-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 3 - 16 December 2011
logo
Integrated Circuit Syst...
74LVC_LVCH16245A ICST-74LVC_LVCH16245A Datasheet
107Kb / 19P
   16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
logo
Nexperia B.V. All right...
74LVC16245A-Q100 NEXPERIA-74LVC16245A-Q100 Datasheet
248Kb / 14P
   16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
74LVCH16245A NEXPERIA-74LVCH16245A Datasheet
260Kb / 15P
   16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 14 - 24 September 2021
logo
NXP Semiconductors
74LVC_LVCH16245A PHILIPS-74LVC_LVCH16245A_15 Datasheet
283Kb / 20P
   16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 12-13 February 2012
74LVC16245A PHILIPS-74LVC16245A Datasheet
122Kb / 19P
   16-bit bus transceiver with direction pin; 5 V tolerant; 3-state
Rev. 08-6 November 2008
More results


Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16


Folha de dados Download

Go To PDF Page


Ligação URL




Privacy Policy
ALLDATASHEETPT.COM
ALLDATASHEET é útil para você?  [ DONATE ] 

Sobre Alldatasheet   |   Publicidade   |   Contato conosco   |   Privacy Policy   |   roca de Link   |   Lista de Fabricantes
All Rights Reserved©Alldatasheet.com


Mirror Sites
English : Alldatasheet.com  |   English : Alldatasheet.net  |   Chinese : Alldatasheetcn.com  |   German : Alldatasheetde.com  |   Japanese : Alldatasheet.jp
Russian : Alldatasheetru.com  |   Korean : Alldatasheet.co.kr  |   Spanish : Alldatasheet.es  |   French : Alldatasheet.fr  |   Italian : Alldatasheetit.com
Portuguese : Alldatasheetpt.com  |   Polish : Alldatasheet.pl  |   Vietnamese : Alldatasheet.vn
Indian : Alldatasheet.in  |   Mexican : Alldatasheet.com.mx  |   British : Alldatasheet.co.uk  |   New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com  |   icmetro.com