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TPA311DG4 Folha de dados(PDF) 1 Page - Texas Instruments |
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TPA311DG4 Folha de dados(HTML) 1 Page - Texas Instruments |
1 / 35 page TPA311 350-mW MONO AUDIO POWER AMPLIFIER SLOS207C – JANUARY 1998 – REVISED MAY 2003 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Fully Specified for 3.3-V and 5-V Operation D Wide Power Supply Compatibility 2.5 V – 5.5 V D Output Power for RL = 8 Ω – 350 mW at VDD = 5 V, BTL – 250 mW at VDD = 5 V, SE – 250 mW at VDD = 3.3 V, BTL – 75 mW at VDD = 3.3 V, SE D Shutdown Control – IDD = 7 µA at 3.3 V – IDD = 60 µA at 5 V D BTL to SE Mode Control D Integrated Depop Circuitry D Thermal and Short-Circuit Protection D Surface Mount Packaging – SOIC – PowerPAD MSOP description The TPA311 is a bridge-tied load (BTL) or single-ended (SE) audio power amplifier devel- oped especially for low-voltage applications where internal speakers and external earphone operation are required. Operating with a 3.3-V supply, the TPA311 can deliver 250-mW of continuous power into a BTL 8- Ω load at less than 1% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. A unique feature of the TPA311 is that it allows the amplifier to switch from BTL to SE on the fly when an earphone drive is required. This eliminates complicated mechanical switching or auxiliary devices just to drive the external load. This device features a shutdown mode for power-sensitive applications with special depop circuitry to virtually eliminate speaker noise when exiting shutdown mode and during power cycling. The TPA311 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which reduces board space by 50% and height by 40%. Audio Input Bias Control 350 mW 6 5 7 VO+ VDD 3 1 2 4 BYPASS IN SE/BTL VDD/2 CI RI CS CBF RF SHUTDOWN From HP Jack VO–8 GND From System Control CC – + – + Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 1998 – 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. 1 2 3 4 8 7 6 5 SHUTDOWN BYPASS SE/BTL IN VO– GND VDD VO+ D OR DGN PACKAGE (TOP VIEW) PowerPAD is a trademark of Texas Instruments. |
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