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ORDERING INFORMATION

ABSOLUTE MAXIMUM RATINGS

RECOMMENDED OPERATING CONDITIONS

PACKAGE DISSIPATION RATINGS

TPA2010D1

SLOS417B – OCTOBER 2003 – REVISED JULY 2006

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

PACKAGE

PART NUMBER

SYMBOL

Wafer chip scale package (YEF)

AJZ

–40

°C to 85°C

Wafer chip scale packaging – Lead free (YZF)

AKO

(1)

The YEF and YZF packages are only available taped and reeled. To order add the suffix R to the end of the part number for a reel of

3000, or add the suffix T to the end of the part number for a reel of 250 (e.g. TPA2010D1YEFR).

TPA2010D1

In active mode

–0.3 V to 6 V

Supply voltage

In SHUTDOWN mode

–0.3 V to 7 V

Input voltage

Continuous total power dissipation

See Dissipation Rating Table

Operating free-air temperature

–40

°C to 85°C

Operating junction temperature

–40

°C to 125°C

Storage temperature

–65

°C to 150°C

YZF

260

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

YEF

235

°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

MIN

NOM

MAX

UNIT

Supply voltage

2.5

5.5

V

High-level input voltage

SHUTDOWN

1.3

V

Low-level input voltage

SHUTDOWN

0

0.35

V

Input resistor

Gain

≤ 20 V/V (26 dB)

15

k

Ω

0.5

V

8

Operating free-air temperature

–40

85

°C

PACKAGE

POWER RATING

POWER RATING

POWER RATING

YEF

7.8 mW/

°C

780 mW

429 mW

312 mW

YZF

7.8 mW/

°C

780 mW

429 mW

312 mW

(1)

Derating factor measure with High K board.

2

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